Colloquium announcement
Faculty of Engineering Technology
Department Energy Technology (TFE)
Master programme Mechanical Engineering
As part of his / her master assignment
Boer, J. de (Jelmer)
will hold a speech entitled:
Performance characterization of silicone-free gap fllers in electronic packaging design
Date | 07-10-2022 |
Time | 13:30 |
Room | OH 210 |
Summary
Thales Nederland develops electronic packages for naval systems and sensors in the defense industry. Recent technological developments of electronic components have led to an increased demand for effective, predictable, and reliable cooling of electronic systems and components. Thermal Interface Materials (TIMs) can be applied to optimize the heat path between heat dissipating components towards heat sinks. Due to the build-up of engineering tolerances in designs, which are typically in order of 0.5mm, a TIM needs to be compliant and conform to a wide range of gap sizes.
Gap fillers, a subcategory of TIMs, are applied to this end. However, the current knowledge on degradation and performance over time is limited. New candidate materials are sought, which are free of silicone, and engineering guidelines for designs with gap fillers are asked for. This study offers a theoretical framework which encompasses a literature review of relevant degradation mechanisms for TIMs, as well as methods to artificially age a TIM such that behavior over time can be identified.
Candidate gap fillers are identified, and tests developed and implemented to artificially age the materials. In addition to characterizing the performance over time, non-destructive images are made through Scanning Acoustic Microscopy (SAM). From comparing the images, dominant mechanisms are determined. Engineering guidelines and safety factors are established.
Assessment committee |
chair Signature d.d. |
|
prof.dr.ir. W. Rohlfs ir. D. de Zeeuw dr. M. Mehrali dr.ir. C.W. Visser |
(chair) (mentor from company) (internal member) (external member) |